MOQ: | 1 Piece/Pieces |
Payment Method: | T/T |
Supply Capacity: | 100,000/year |
Features:
830nm wavelength
600mW output power
△λ<0.12nm
Applications:
Raman Spectroscopy
Sensing
Medical
Specifications(25℃)
|
Symbol
|
Unit
|
K830AFLWN-0.600W | |||
Minimum | Typical | Maximum | ||||
Optical Data | CW-Output Power | Po | mW | 600 | - | - |
Center Wavelength | λc | nm | 830±0.5nm | |||
Spectral Width (FWHM) | △λ | nm | <0.12 | |||
Wavelength Shift with Temperature | △λ/△T | nm/℃ | - | 0.01 | - | |
Wavelength Shift with Current | △λ/△A | nm/A | - | 0.03 | - | |
Electrical Data | Electrical-to-Optical Efficiency | PE | % | - | 30 | - |
Threshold current | lth | A | - | 0.3 | - | |
Operating current | lop | A | - | - | 1 | |
Operating voltage | Vop | V | - | 1.8 | 6 | |
Slope Efficiency | η | W/A | - | 0.9 | - | |
PD Data |
Current | Lmo | μA | 100 | - | 1000 |
Themistor | - | Rt | (K Ω)/β(25℃) | - | 10±3%/3477 | - |
TEC Data | Max. Current | - | A | - | 2.2 | |
Max. Voltage | - | V | - | - | 8.7 | |
Others | ESD | Vesd | V | - | - | 500 |
Storage temperature | Tst | ℃ | -20 | - | 70 | |
Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
Lead Soldering Time | t | sec | - | - | 10 | |
Operating case temperature | Top | ℃ | 15 | - | 35 | |
Relative Humidity | RH | % | 15 | - | 75 |
MOQ: | 1 Piece/Pieces |
Payment Method: | T/T |
Supply Capacity: | 100,000/year |
Features:
830nm wavelength
600mW output power
△λ<0.12nm
Applications:
Raman Spectroscopy
Sensing
Medical
Specifications(25℃)
|
Symbol
|
Unit
|
K830AFLWN-0.600W | |||
Minimum | Typical | Maximum | ||||
Optical Data | CW-Output Power | Po | mW | 600 | - | - |
Center Wavelength | λc | nm | 830±0.5nm | |||
Spectral Width (FWHM) | △λ | nm | <0.12 | |||
Wavelength Shift with Temperature | △λ/△T | nm/℃ | - | 0.01 | - | |
Wavelength Shift with Current | △λ/△A | nm/A | - | 0.03 | - | |
Electrical Data | Electrical-to-Optical Efficiency | PE | % | - | 30 | - |
Threshold current | lth | A | - | 0.3 | - | |
Operating current | lop | A | - | - | 1 | |
Operating voltage | Vop | V | - | 1.8 | 6 | |
Slope Efficiency | η | W/A | - | 0.9 | - | |
PD Data |
Current | Lmo | μA | 100 | - | 1000 |
Themistor | - | Rt | (K Ω)/β(25℃) | - | 10±3%/3477 | - |
TEC Data | Max. Current | - | A | - | 2.2 | |
Max. Voltage | - | V | - | - | 8.7 | |
Others | ESD | Vesd | V | - | - | 500 |
Storage temperature | Tst | ℃ | -20 | - | 70 | |
Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
Lead Soldering Time | t | sec | - | - | 10 | |
Operating case temperature | Top | ℃ | 15 | - | 35 | |
Relative Humidity | RH | % | 15 | - | 75 |