MOQ: | 1 Piece/Pieces |
Standard Packaging: | Coaxial |
Delivery Period: | 3-6weeks |
Payment Method: | T/T |
Supply Capacity: | 100,000/year |
Features:
405nm wavelength
160mW output power
40µm fiber core diameter
0.22N.A.
Applications:
Printing
Specifications(25℃) | Symbol | Unit | K405E03CN-0.160W | |||
Minimum | Typical | Maximum | ||||
Optical Data
|
CW-Output Power | Po | mW | 160 | - | - |
Center wavelength | ʎc | nm | 405±5 | |||
Spectral width(FWHM) | Δʎ | nm | - | 4 | - | |
Wavelength Shift with Temperature | △ʎ/△T | nm/℃ | - | 0.3 | - | |
Electrical Data | Slope Efficiency | η | W/A | - | 1.4 | - |
Electrical-to-Optical Efficiency | PE | % | 20 | - | ||
Threshold current | Ith | mA | - | 30 | - | |
Operating current | lop | mA | - | - | 150 | |
Operating voltage | Vop | V | - | - | 5.5 | |
Fiber Data | Core Diameter | Dcore | µm | - | 40 | - |
Numerical Aperture | NA | NA | - | 0.22 | - | |
Others | ESD | Vesd | V | - | - | 500 |
Storage Temperature | Tstg | ℃ | -20 | - | 70 | |
Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
Lead Soldering Time | t | sec | - | - | 10 | |
Operating case temperature | Top | ℃ | 15 | - | 35 | |
Relative Humidity | RH | % | 15 | - | 75 |
MOQ: | 1 Piece/Pieces |
Standard Packaging: | Coaxial |
Delivery Period: | 3-6weeks |
Payment Method: | T/T |
Supply Capacity: | 100,000/year |
Features:
405nm wavelength
160mW output power
40µm fiber core diameter
0.22N.A.
Applications:
Printing
Specifications(25℃) | Symbol | Unit | K405E03CN-0.160W | |||
Minimum | Typical | Maximum | ||||
Optical Data
|
CW-Output Power | Po | mW | 160 | - | - |
Center wavelength | ʎc | nm | 405±5 | |||
Spectral width(FWHM) | Δʎ | nm | - | 4 | - | |
Wavelength Shift with Temperature | △ʎ/△T | nm/℃ | - | 0.3 | - | |
Electrical Data | Slope Efficiency | η | W/A | - | 1.4 | - |
Electrical-to-Optical Efficiency | PE | % | 20 | - | ||
Threshold current | Ith | mA | - | 30 | - | |
Operating current | lop | mA | - | - | 150 | |
Operating voltage | Vop | V | - | - | 5.5 | |
Fiber Data | Core Diameter | Dcore | µm | - | 40 | - |
Numerical Aperture | NA | NA | - | 0.22 | - | |
Others | ESD | Vesd | V | - | - | 500 |
Storage Temperature | Tstg | ℃ | -20 | - | 70 | |
Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
Lead Soldering Time | t | sec | - | - | 10 | |
Operating case temperature | Top | ℃ | 15 | - | 35 | |
Relative Humidity | RH | % | 15 | - | 75 |