|
| MOQ: | 1 Piece/Pieces |
| Standard Packaging: | Coaxial |
| Delivery Period: | 3-6weeks |
| Payment Method: | T/T |
| Supply Capacity: | 100,000/year |
Features:
405nm wavelength
160mW output power
40µm fiber core diameter
0.22N.A.
Applications:
Printing
| Specifications(25℃) | Symbol | Unit | K405E03CN-0.160W | |||
| Minimum | Typical | Maximum | ||||
|
Optical Data
|
CW-Output Power | Po | mW | 160 | - | - |
| Threshold current | Ith | mA | 30 | |||
| Operating current | Iop | mA | 150 | |||
| Operating voltage | Vop | V | 5.5 | |||
| Reverse Voltage | Vre | V | 5.5 | |||
| Slope Efficiency | η | W/A | 1.4 | |||
| Electrical-to-Optical Efficiency | PE | % | 20 | |||
| Center wavelength | ʎc | nm | 400 | 410 | ||
| Spectral width(FWHM) | Δʎ | nm | 4 | |||
| Wavelength Shift with Temperature | - | nm/℃ | 0.3 | |||
| Fiber Data | Core Diameter | Dcore | µm | 40 | ||
| Numerical Aperture | NA | NA | 0.22 | |||
| Others | ESD | Vesd | V | 500 | ||
| Storage Temperature | Tstg | ℃ | -20 | 70 | ||
| Lead Soldering Temp | Tls | ℃ | 260 | |||
| Lead Soldering Time | t | sec | 10 | |||
| Operating case temperature | Top | ℃ | 15 | 35 | ||
| Relative Humidity | RH | % | 15 | 75 | ||
|
|
| MOQ: | 1 Piece/Pieces |
| Standard Packaging: | Coaxial |
| Delivery Period: | 3-6weeks |
| Payment Method: | T/T |
| Supply Capacity: | 100,000/year |
Features:
405nm wavelength
160mW output power
40µm fiber core diameter
0.22N.A.
Applications:
Printing
| Specifications(25℃) | Symbol | Unit | K405E03CN-0.160W | |||
| Minimum | Typical | Maximum | ||||
|
Optical Data
|
CW-Output Power | Po | mW | 160 | - | - |
| Threshold current | Ith | mA | 30 | |||
| Operating current | Iop | mA | 150 | |||
| Operating voltage | Vop | V | 5.5 | |||
| Reverse Voltage | Vre | V | 5.5 | |||
| Slope Efficiency | η | W/A | 1.4 | |||
| Electrical-to-Optical Efficiency | PE | % | 20 | |||
| Center wavelength | ʎc | nm | 400 | 410 | ||
| Spectral width(FWHM) | Δʎ | nm | 4 | |||
| Wavelength Shift with Temperature | - | nm/℃ | 0.3 | |||
| Fiber Data | Core Diameter | Dcore | µm | 40 | ||
| Numerical Aperture | NA | NA | 0.22 | |||
| Others | ESD | Vesd | V | 500 | ||
| Storage Temperature | Tstg | ℃ | -20 | 70 | ||
| Lead Soldering Temp | Tls | ℃ | 260 | |||
| Lead Soldering Time | t | sec | 10 | |||
| Operating case temperature | Top | ℃ | 15 | 35 | ||
| Relative Humidity | RH | % | 15 | 75 | ||
