|
| MOQ: | 1 Piece/Pieces |
| Delivery Period: | 4-8weeks |
| Payment Method: | T/T |
| Supply Capacity: | 100,000/year |
808nm 30W 0.22N.A. High Brightness Pump High Power Diode Laser Module
Features:
808nm wavelength
30W output power
400μm fiber core diameter
0.22 N.A.
Applications:
Solid-state laser pumping
Medical Use
Material processing
| Specifications(25℃) | Symbol | Unit | K808DAECN-30.00W | |||
| Minimum | Typical | Maximum | ||||
|
Optical Data
|
CW-Output Power | Po | W | 30 | - | - |
| Threshold current | Ith | A | - | 1.8 | ||
| Operating current | Iop | A | - | 10 | 11 | |
| Operating voltage | Vop | V | - | - | 8 | |
| Reverse Voltage | Vre | V | - | 10 | - | |
| Slope Efficiency | η | W/A | - | 4 | - | |
| Electrical-to-Optical Efficiency | PE | % | - | 48 | - | |
| Center wavelength | ʎc | nm | 805 | - | 811 | |
| Spectral width(FWHM) | δλ | nm | - | 3 | - | |
| Wavelength Shift with Temperature | - | nm/℃ | - | 0.3 | - | |
| Wavelength Shift with Current | - | nm/A | - | 1 | - | |
| Fiber Data | Buffer diameter | Dbuf | µm | - | 730 | - |
| Cladding diameter | Dclad | µm | - | 440 | - | |
| Core diameter | Dcore | µm | - | 400 | - | |
| Numeric aperture | NA | - | - | 0.22 | - | |
| Connector | - | - | - | SMA905 | ||
| Thermistor | - | Rt | (K Ω)/β(25℃) | - | 10±3%/3477 | - |
| Others | ESD | Vesd | V | - | 500 | |
| Storage Temperature | Tstg | ℃ | -20 | - | 70 | |
| Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
| Lead Soldering Time | t | sec | - | - | 10 | |
| Operating case temperature | Top | ℃ | 15 | - | 35 | |
| Relative Humidity | RH | % | 15 | - | 75 | |
|
|
| MOQ: | 1 Piece/Pieces |
| Delivery Period: | 4-8weeks |
| Payment Method: | T/T |
| Supply Capacity: | 100,000/year |
808nm 30W 0.22N.A. High Brightness Pump High Power Diode Laser Module
Features:
808nm wavelength
30W output power
400μm fiber core diameter
0.22 N.A.
Applications:
Solid-state laser pumping
Medical Use
Material processing
| Specifications(25℃) | Symbol | Unit | K808DAECN-30.00W | |||
| Minimum | Typical | Maximum | ||||
|
Optical Data
|
CW-Output Power | Po | W | 30 | - | - |
| Threshold current | Ith | A | - | 1.8 | ||
| Operating current | Iop | A | - | 10 | 11 | |
| Operating voltage | Vop | V | - | - | 8 | |
| Reverse Voltage | Vre | V | - | 10 | - | |
| Slope Efficiency | η | W/A | - | 4 | - | |
| Electrical-to-Optical Efficiency | PE | % | - | 48 | - | |
| Center wavelength | ʎc | nm | 805 | - | 811 | |
| Spectral width(FWHM) | δλ | nm | - | 3 | - | |
| Wavelength Shift with Temperature | - | nm/℃ | - | 0.3 | - | |
| Wavelength Shift with Current | - | nm/A | - | 1 | - | |
| Fiber Data | Buffer diameter | Dbuf | µm | - | 730 | - |
| Cladding diameter | Dclad | µm | - | 440 | - | |
| Core diameter | Dcore | µm | - | 400 | - | |
| Numeric aperture | NA | - | - | 0.22 | - | |
| Connector | - | - | - | SMA905 | ||
| Thermistor | - | Rt | (K Ω)/β(25℃) | - | 10±3%/3477 | - |
| Others | ESD | Vesd | V | - | 500 | |
| Storage Temperature | Tstg | ℃ | -20 | - | 70 | |
| Lead Soldering Temp | Tls | ℃ | - | - | 260 | |
| Lead Soldering Time | t | sec | - | - | 10 | |
| Operating case temperature | Top | ℃ | 15 | - | 35 | |
| Relative Humidity | RH | % | 15 | - | 75 | |
